ECX-3000 | High-Performance Fanless System
ECX-3000 DATASHEET
Rugged Fanless Industrial High-Performance Computer
Features
- 13th/12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S/Alder Lake-S) with intelligent workload optimization, up to 36% CPU performance improved
- Intel® UHD Graphics 770 driven by Intel® Xe Architecture, with max 94% graphics performance and 181% GPU image classification inference performance enhanced
- 8 Independent 2.5G LAN with 4 IEEE 802.3at PoE+
- 4 Front-access M.2 SSD Tray, 6 USB 3.2 Gen 2
- DC 9V to 50V Power Input, Software Ignition Control
- Supports Intel® TPM 2.0 and Time-Sensitive Networking (TSN)
- Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications
Overview
Powered by 13th/12th Gen Intel® Core™ i9/i7/i5/i3 processor (Raptor Lake/Alder Lake) with Intel® 600 Series Chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration, max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, Vecow ECX-3000 Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.
Specifications
System
Processor －24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
－16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset Intel® 600 Series BIOS AMI SIO IT8786E Memory 2 DDR4 3200MHz SO-DIMM, up to 64GB (ECC/Non-ECC) OS Windows 10, Linux I/O Interface
Serial Up to 4 COM RS-232/422/485 USB 6 USB 3.2 Gen 2 Isolated DIO 16 Isolated DIO : 8 DI, 8 DO (Optional) LED Power, HDD, PoE, Wireless SIM Card 2 External SIM Card Sockets RTC Battery Front-access RTC Battery Expansion
Mini PCIe 1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA M.2 - 1 M.2 Key B Socket (3042/3052)
- 1 M.2 Key E Socket (2230)
SUMIT A, B 2 SUMIT Slot (Optional) Graphics
Graphics Processor Intel® UHD Graphics 770 driven by Intel® Xe Architecture Interface 4 independent displays :
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz- 1 DVI-I : Up to 1920 x 1080 @60Hz
- 1 HDMI : Up to 4096 x 2160 @60Hz
Storage
SATA 2 SATA III (6Gbps) support S/W RAID 0, 1 mSATA 1 SATA III (Mini PCIe Type, 6Gbps) M.2 1 M.2 Key M Socket (2280, PCIe x4) Storage Device - Front-access 2.5" SSD/HDD Tray
- 4 Front-access M.2 Key M SSD Tray (ECX-3000 PoES)
Audio
Audio Codec Realtek® ALC888S-VD, 7.1 Channel HD Audio Audio Interface 1 Mic-in, 1 Line-out Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT LAN 2 Intel® I225 2.5GigE LAN supports TSN 2.5G PoE
LAN 3 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I225 LAN 4 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I225 LAN 5 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I225 LAN 6 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I225 2.5G Ethernet (ECX-3025R/3025)
LAN 7 Intel® I225 2.5GigE LAN LAN 8 Intel® I225 2.5GigE LAN LAN 9 Intel® I225 2.5GigE LAN 10G Ethernet (ECX-3071XR/3071X)
LAN 7 Intel® X710-AT2 10GigE LAN LAN 8 Intel® X710-AT2 10GigE LAN Power
Power Input DC 9V to 50V Power Interface - 3-pin Terminal Block : V+, V-, Frame Ground
- 4-pin Mini-DIN
Ignition Control 16-mode Software Ignition Control Remote Switch 3-pin Terminal Block Others
TPM Infineon SLB9670 supports TPM 2.0, SPI Interface Watchdog Timer Reset : 1 to 255 sec./min. per step Smart Mgmt. Wake on LAN, PXE supported HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats. Mechanical
Dimension 260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11") Weight 3.8 kg (8.38 lb) Mounting - Wallmount by mounting bracket
- DIN Rail Mount (Optional)
- 2U Rackmount (Optional)
Environment
Operating Temperature 35W TDP CPU :
-40°C to 75°C (-40°F to 167°F), Fanless
65W TDP CPU :
-40°C to 55°C (-40°F to 131°F), Fanless
2.5G Series :
-40°C to 70°C (-40°F to 158°F), Fanless
10G Series :
0°C to 50°C (32°F to 122°F), with Internal Fan
Storage Temperature -40°C to 85°C (-40°F to 185°F) Humidity 5% to 95% Humidity, non-condensing Relative Humidity 95% @75°C Shock - IEC 60068-2-27
- SSD : 50G @wallmount, Half-sine, 11ms
Vibration - IEC 60068-2-64
- SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2